Method for applying uniform pressurized film across wafer
US6518172B1 · kind B1 · utility
8Cited by
56References
68Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2000 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Aug 29, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31058
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing semiconductor devices using an improved planarization processes for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer using a fixed resilient flexible material member contacting the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.