Apparatus for metal stack thermal management in semiconductor devices
US6518661B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Apr 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor apparatus includes a semiconductor body in the form of a silicon substrate havng a plurality of active devices. A metal stack including a plurality of metal layers is operatively associated with the active devices. A plurality of conductive elements are connected to the metal stack and to a substrate in the form of for example a printed circuit board. Vias connect conductive elements with respective portions of at least some of the metal layers, with the conductive elements connected to heat absorbing members within the substrate, which is in turn connected to a heat sink external to the substrate, the vias being spaced at regular intervals so as to promote heat dissipation from the metal stack therethrough to the heat absoring members and the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.