Method for electroless copper deposition using a hypophosphite reducing agent
US6524490B1 · kind B1 · utility
1Cited by
6References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | May 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1157
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for improving the electrical conductivity and appearance of copper films produced by reduction of copper ions using hypophosphite, comprising exposure of the as-deposited copper film to a solution of dimethylamino borane (DMAB) or equivalents thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.