J.G. Systems Inc.
10Patents
0Active
10Granted
29Portfolio score
Filing activity: Jun 24, 1997 → Oct 5, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6875097B2 | Fixed abrasive CMP pad with built-in additives | Performing Operations; Transporting | 50 | Expired |
| US5895581A | Laser imaging of printed circuit patterns without using phototools | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6896710B2 | Abrasives for CMP applications | Electricity | 4 | Expired |
| US6599563B2 | Method and apparatus for improving interfacial chemical reactions in electroless depositions of metals | Chemistry; Metallurgy | 2 | Expired |
| US7247557B2 | Method and composition to minimize dishing | Electricity | 1 | Expired |
| US6524490B1 | Method for electroless copper deposition using a hypophosphite reducing agent | Electricity | 1 | Expired |
| US6955586B2 | CMP composition and process | Electricity | 0 | Expired |
| US7148147B2 | CMP composition containing organic nitro compounds | Electricity | 0 | Expired |
| US6805911B2 | Method and apparatus for improving interfacial chemical reactions | Electricity | 0 | Expired |
| US6998066B2 | CMP composition containing organic nitro compounds | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.