Method of controlling photoresist thickness based upon photoresist viscosity
US6524774B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Sep 30, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention is directed to a system and method for controlling the formation of a layer of photoresist. In one illustrative embodiment, the method comprises sensing a viscosity of the photoresist material to be applied on a process layer, providing the sensed viscosity to a controller that determines, based upon the sensed viscosity, at least one parameter of a photoresist application process used to apply the photoresist material, and applying the photoresist using an application process that is comprised of said determined parameter. In one illustrative embodiment, the system is comprised of at least one sensor for sensing the viscosity of the photoresist, a controller that receives the sensed viscosity and determines, based upon the sensed viscosity, at least one parameter of the application process used to apply the photoresist, and a tool for applying the photoresist using a process that includes the determined parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.