Semiconductor device package and method of die attach
US6525423B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 19, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Jun 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inexpensive method of providing uniform and consistent spacing between a semiconductor die and a supporting substrate includes providing relatively rigid spacers such as a plurality of lengths of wires or a plurality of bumps on the mounting surface for the chip. The spacers allow a uniform desired spacing of the die from the supporting substrate when attached by an epoxy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.