Method of assembling a snap lid image sensor package
US6526653B1 · kind B1 · utility
64Cited by
14References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49876
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.