Method and apparatus for forming solder bumps
US6527158B1 · kind B1 · utility
34Cited by
14References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Mar 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0113
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 &mgr;m per inch of die length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.