Methods of making bondable contacts and a tool for making such contacts
US6527163B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 21, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Nov 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making bondable contacts on a microelectronic element includes providing a microelectronic element having one or more die pads on a first face thereof and depositing conductive bonding material, such as gold, atop each die pad. The conductive bonding material is then shaped using a contact forming tool to form bondable contacts. The bondable contact has a substantially flat region and a second region projecting above the substantially flat region. The second region includes an apex adapted to abut against an opposing electrically conductive element. The bondable contacts may be formed one at a time or a plurality of the bondable contacts may be formed simultaneously. In one preferred embodiment, the projecting region of the contact defines a wedge-shaped projection that is bounded by the substantially flat region thereof. Each wedge-shaped projection may include an apex and side-walls extending between the apex and the substantially flat region of the contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.