Hamid Eslampour
12Patents
4h-index
18Co-inventors
57Inventor score
Filing activity: May 5, 2000 → Mar 15, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6495462B1 | Components with releasable leads | Electricity | 17 | Expired |
| US6527163B1 | Methods of making bondable contacts and a tool for making such contacts | Electricity | 7 | Expired |
| US7099360B2 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Electricity | 5 | Expired |
| US7401986B2 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Electricity | 5 | Active |
| US7040012B2 | Method of electrically and mechanically connecting electronic devices to one another | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8057108B2 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Electricity | 3 | Active |
| US7780360B2 | Method and apparatus to generate and monitor optical signals and control power levels thereof in a planar lightwave circuit | Electricity | 2 | Active |
| US7050682B2 | Measuring the position of passively aligned optical components | Electricity | 1 | Expired |
| US6959134B2 | Measuring the position of passively aligned optical components | Electricity | 1 | Expired |
| US8409921B2 | Integrated circuit package system including honeycomb molding | Electricity | 0 | Active |
| US7260296B2 | Measuring the position of passively aligned optical components | Electricity | 0 | Expired |
| US11834328B2 | Semiconductor package with built-in vibration isolation, thermal stability, and connector decoupling | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.