Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications
US6528352B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2001 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Oct 17, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/0408
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A structure and method for converting a standard ceramic carrier into a temporary chip attach carrier, wherein the device comprises a substrate, a plurality of metal vias interspersed in the substrate, a carrier layer further comprising a cavity dam with a plurality of holes filled with conductive adhesive. The process of forming the temporary chip attach carrier comprises applying a secondary layer further comprising a plurality of holes on a substrate, applying conductive adhesive in the holes, curing the adhesive, placing a chip containing C4 solder bumps onto the secondary layer, applying a force onto the chip, testing and burning-in the secondary layer, removing the force from the chip, separating the chip from the secondary layer, and then re-using the secondary layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.