Micromachine stacked flip chip package fabrication method
US6530515B1 · kind B1 · utility
83Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 8, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
To form a micromachine package, bond pads on a front surface of a controller chip are aligned with corresponding traces on a front surface of a micromachine chip. The bond pads are physically connected to the traces thus mounting the controller chip as a flip chip to the micromachine chip. A bead is formed around a periphery of the controller chip. The bead and the controller chip form an enclosure around a micromachine area in the front surface of the micromachine chip. This enclosure protects the micromachine area from the ambient environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.