Chip scale electrical test fixture with isolation plate having a recess
US6531774B1 · kind B1 · utility
5Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | May 3, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test fixture with an isolation plate grounds all of the solder balls of a ball grid array (BGA) of a chip scale package, except for a selected subset of the solder balls, to perform electrical characterization of the package. The isolation plate includes a recess ground into the plate, and a hole in the recess that permits access to the selected subset of solder balls. The recess provides clearance for a fixed compliant probe to land on the solder balls to be tested through the hole, and a probe contact surface for a ground portion of the probe to securely land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.