Device for handling wafers in microelectronic manufacturing
US6533531B1 · kind B1 · utility
18Cited by
27References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 1998 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Dec 29, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer handling device includes a platform having a plurality of movable grippers. A driver is mounted on the platform and selectively couples to at least one of the plurality of grippers to selectively move at least one of the plurality of grippers with regard to the platform. The driver may be magnetically coupled to at least one gripper to move it between a first proximal position and a first distal position. The driver may be mounted on the platform with a track assembly that effectuates a linear magnetic propulsion field to move the driver between the first axial position and the second axial position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.