Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
US6534179B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.