Methods of making microelectronic assemblies using bonding stage and bonding stage therefor
US6534392B1 · kind B1 · utility
0Cited by
8References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2001 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Sep 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making a microelectronic assembly comprises connecting a lead to a contact on a microelectronic element and to a stage. The microelectronic element is juxtaposed with a microelectronic component and the lead is disconnected from the stage. The lead is bonded to a terminal pad on the microelectronic component. A stage for making a microelectronic assembly has a conduit for introducing a bonding tool toward a lead bonded to the stage and extending across the conduit while the microelectronic element is juxtaposed with the microelectronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.