Jim Behlen
3Patents
2h-index
4Co-inventors
30Inventor score
Filing activity: Feb 8, 1999 → Sep 14, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6169328A | Semiconductor chip assembly | Electricity | 84 | Expired |
| US6521480B1 | Method for making a semiconductor chip package | Electricity | 37 | Expired |
| US6534392B1 | Methods of making microelectronic assemblies using bonding stage and bonding stage therefor | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.