Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US6535386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Dec 5, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic assembly is described including a motherboard, a semiconductor die mounted to the motherboard, and a heat pipe having an evaporator portion adjacent the die, and a condenser portion distant from the die. The heat pipe is connected to a ground plane of the motherboard at various locations. Structural integrity of the heat pipe is provided by an insert in an evaporator portion of the heat pipe and because of opposing recessed seat portions that contact one another. Another feature of the electronic assembly is that it has a sheet of material forming a plurality of fins that are welded to a condenser portion of the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.