Wafer chuck for use in edge bevel removal of copper from silicon wafers
US6537416B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 25, 2000 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Apr 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck includes alignment members that allows a semiconductor wafer to be properly aligned on the chuck without using a separate alignment stage. The alignment members may be cams, for example, attached to arms of the wafer chuck. These members may assume an alignment position when a robot arm places the wafer on the chuck. In this position, they guide the wafer into a proper alignment position with respect to the chuck. During rotation at a particular rotational speed, the alignment members move away from the wafer to allow liquid etchant to flow over the entire edge region of the wafer. At still higher rotational speeds, the wafer is clamped into position to prevent it from flying off the chuck. A clamping cam or other device (such as the alignment member itself) may provide the clamping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.