Megasonic treatment apparatus
US6539952B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 24, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Aug 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer. In a wafer etch application, the megasonic energy is used to enhance the etch rate on the surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.