Carrier head with reduced moment wear ring
US6540592B1 · kind B1 · utility
13Cited by
14References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Nov 20, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A work piece carrier head for a CMP or other polishing apparatus is configured to eliminate the slow band associated with the polishing of the surface of a work piece. The carrier head includes a wear ring that is positioned circumferentially about the work piece and that together with the work piece is pressed against a moving polishing pad. The wear ring is resiliently coupled to the body of the carrier head in a manner to avoid any overturning moment on the ring caused by the frictional force of the polishing pad against the wear ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.