Imaging of integrated circuit interconnects
US6541286B1 · kind B1 · utility
6Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Jun 27, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/302
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method is provided for X-ray imaging and analyzing grain boundaries, nodules or extrusions, voids, and separations or delaminations in conductive layers under dielectric capping layers in integrated circuit interconnects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.