Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
US6542720B1 · kind B1 · utility
98Cited by
34References
31Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 1, 1999 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Mar 1, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices are described. In one embodiment, a microelectronic device includes a microelectronic package which provides a housing within which integrated circuitry is received. An integrated circuit die is received within the microelectronic package and includes integrated circuitry formed thereon. The integrated circuitry comprises first transmit/receive circuitry configured to transmit and receive radio frequency signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.