Apparatus and method for cleaning semiconductor substrate
US6543080B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Aug 25, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B3/12
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A semiconductor substrate cleaning apparatus and method are capable of efficiently removing contamination from both the obverse and reverse sides of a semiconductor substrate. A single cleaning liquid supply nozzle for supplying a cleaning liquid to both the obverse and reverse sides of a semiconductor substrate to be cleaned is placed at a distance from the outer peripheral edge of the substrate. An ultrasonic vibrator applies ultrasonic waves to both the obverse and reverse sides of the substrate. Four driving rollers are disposed in contact with the outer peripheral edge of the substrate. The driving rollers are adapte to rotate while being engaged with the outer peripheral edge of the substrate thereby drivingly rotating the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.