Coplanarity inspection at the singulation process
US6543127B1 · kind B1 · utility
2Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2000 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | May 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In accordance with the objectives of the invention a new method and apparatus is provide for assuring contact balls coplanarity. The process and apparatus for coplanarity inspection is integrated with the current processing step of BGA device singulation and pick-and-place, thereby eliminating the need for a separate processing step that is typically required for the coplanarity inspection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.