Patent · US Expired

MRAM module configuration

US6545900B2 · kind B2 · utility

10Cited by

5References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Böhm · Zorneding, DE
Dietmar Gogl · South Burlington, US
Martin Freitag · Munich, DE
Stefan Lammers · Hersbruck, DE

Key dates

Filing date	Sep 12, 2001
Grant date	Apr 8, 2003
Priority date	—
Expiry date	Sep 12, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH10B61/00
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

An MRAM module configuration in which, in order to increase the packing density, memory cell zones containing memory arrays and peripheral circuits are nested in one another. In this manner, an increased packing density of the memory cell is achieved which results in lowered production costs and a smaller chip space for a more compact configuration.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.