Subaperture chemical mechanical planarization with polishing pad conditioning
US6547651B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/085
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Specific embodiments of the present invention provide a chemical-mechanical planarization apparatus for planarizing an object comprising a platen assembly for holding an object having a target surface to be planarized. A polishing pad is configured to contact the object during planarization with a contact portion over a contact area which is smaller in area than the target surface. The polishing pad has a noncontact portion which is not in contact with the object during planarization. The polishing pad is movable relative to the object to move the noncontact portion in contact with the object and move the contact portion out of contact with the object. A conditioner is configured to condition the noncontact portion of the polishing pad. The noncontact portion of the polishing pad may be conditioned continuously during planarization of the object by the polishing pad. An abrasive may be delivered to the contact area between the polishing pad and the target surface of the object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.