John M. Boyd
135Patents
19h-index
67Co-inventors
89Inventor score
Filing activity: Jun 22, 1988 → Jun 14, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5362669A | Method of making integrated circuits | Emerging Cross-Sectional Technologies | 107 | Expired |
| US7191787B1 | Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid | Emerging Cross-Sectional Technologies | 75 | Expired |
| US6146242A | Optical view port for chemical mechanical planarization endpoint detection | Performing Operations; Transporting | 67 | Expired |
| US6599765B1 | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection | Performing Operations; Transporting | 53 | Expired |
| US5352923A | Trench resistors for integrated circuits | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5394000A | Trench capacitor structure | Electricity | 45 | Expired |
| US5316978A | Forming resistors for intergrated circuits | Emerging Cross-Sectional Technologies | 45 | Expired |
| US5516710A | Method of forming a transistor | Electricity | 44 | Expired |
| US5275974A | Method of forming electrodes for trench capacitors | Electricity | 40 | Expired |
| US7367345B1 | Apparatus and method for providing a confined liquid for immersion lithography | Emerging Cross-Sectional Technologies | 40 | Expired |
| US6358118B1 | Field controlled polishing apparatus and method | Performing Operations; Transporting | 36 | Expired |
| US6475332B1 | Interlocking chemical mechanical polishing system | Performing Operations; Transporting | 35 | Expired |
| US6435952B1 | Apparatus and method for qualifying a chemical mechanical planarization process | Performing Operations; Transporting | 34 | Expired |
| US5614750A | Buried layer contact for an integrated circuit structure | Electricity | 31 | Expired |
| US4922155A | Protective circuit for reduced voltage lamps | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5773871A | Integrated circuit structure and method of fabrication thereof | Electricity | 23 | Expired |
| US6612904B1 | Field controlled polishing apparatus | Performing Operations; Transporting | 20 | Expired |
| US7615480B2 | Methods of post-contact back end of the line through-hole via integration | Electricity | 20 | Active |
| US5726084A | Method for forming integrated circuit structure | Electricity | 19 | Expired |
| US6488568B1 | Optical view port for chemical mechanical planarization endpoint detection | Performing Operations; Transporting | 18 | Expired |
| US6626743B1 | Method and apparatus for conditioning a polishing pad | Performing Operations; Transporting | 17 | Expired |
| US7153400B2 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Electricity | 17 | Expired |
| US7829152B2 | Electroless plating method and apparatus | Electricity | 16 | Active |
| US6953515B2 | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection | Performing Operations; Transporting | 15 | Expired |
| US6607425B1 | Pressurized membrane platen design for improving performance in CMP applications | Performing Operations; Transporting | 13 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.