Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
US6548175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Apr 15, 2003 |
| Priority date | — |
| Expiry date | May 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention is directed to improved conductive adhesives for solder-free interconnections in microelectronic assembly processes such as for chip carrier-to-substrate attachment. These adhesives are characterized by low tensile modulus, low resistivity, high adhesion strength, and durability of these properties during reliability stress conditions of thermal shock, thermal aging, and temperature/humidity (85° C./85%) exposure of the assembled devices. The adhesives contain a homogeneous solution of a siloxane containing epoxide, a curing agent, a curing catalyst and an organic polymeric or oligomeric additive. A conductive filler is added to the solution forming the filler. Preferred fillers are Ag coated with Pd and Ag coated with Au.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.