Substrate processing apparatus
US6550988B2 · kind B2 · utility
38Cited by
4References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Oct 30, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A removal liquid is supplied to a substrate on which a thin film formed is patterned by dry etching using a resist film as a mask, and cleaning is made with de-ionized water, thereby removing a reaction product generated on the surface of the substrate. After that, the processed substrate is heated, thereby completely drying the substrate from which the reaction product has been eliminated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.