Heat processing apparatus of substrate
US6551448B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Mar 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67098
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is an apparatus for operating heat processing to a substrate, and comprises a heating plate to mount and heat the substrate thereon, a supporting member to support a lower surface of a periphery of the heating plate, and a supporter to support the supporting member. The supporting member has a stepped portion to surround an outer peripheral surface of the heating plate. The supporting member is fixed to the supporter by a fixing member penetrating through the stepped portion in a vertical direction. The fixing member is provided between an inner peripheral surface of the stepped portion and the outer peripheral surface of the heating plate.According to the present invention, since the fixing member is provided between the outer peripheral surface of the heating plate and the inner peripheral surface of the stepped portion, the supporting member does not exist between the fixing member and the outer peripheral surface of the heating plate. Therefore, even when the heating plate is cooled, a part of the supporting member does not shrink toward the heating plate side, contrary to the conventional art. Thus, it is prevented that the part of the supporting member p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.