Segmenting of processing system into wet and dry areas
US6551488B1 · kind B1 · utility
11Cited by
57References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2000 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Dec 2, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for processing a substrate is described. In one aspect, a processing system is provided which includes a wet area and a dry area. In another aspect, a method comprises processing the substrate in the process cell. The substrate is transferred from the process cell to a dry module and then transferring the substrate to a drying area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.