Michael Sugarman
36Patents
14h-index
64Co-inventors
80Inventor score
Filing activity: Mar 4, 1991 → Aug 28, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5656093A | Wafer spacing mask for a substrate support chuck and method of fabricating same | Emerging Cross-Sectional Technologies | 778 | Expired |
| US6416647B1 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | Electricity | 344 | Expired |
| US6258220A | Electro-chemical deposition system | Electricity | 333 | Expired |
| US6081414A | Apparatus for improved biasing and retaining of a workpiece in a workpiece processing system | Emerging Cross-Sectional Technologies | 254 | Expired |
| US6469283B1 | Method and apparatus for reducing thermal gradients within a substrate support | Electricity | 69 | Expired |
| US6582578B1 | Method and associated apparatus for tilting a substrate upon entry for metal deposition | Electricity | 45 | Expired |
| US6290865A | Spin-rinse-drying process for electroplated semiconductor wafers | Emerging Cross-Sectional Technologies | 37 | Expired |
| US6219219A | Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system | Electricity | 32 | Expired |
| US5356486A | Combined wafer support and temperature monitoring device | Electricity | 31 | Expired |
| US6474712B1 | Gripper for supporting substrate in a vertical orientation | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6423636B1 | Process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer | Electricity | 22 | Expired |
| US6523553B1 | Wafer edge cleaning method and apparatus | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6635157B2 | Electro-chemical deposition system | Electricity | 17 | Expired |
| US6955516B2 | Single wafer dryer and drying methods | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5129994A | Method and apparatus to inhibit obstruction of optical transmission through semiconductor etch process chamber viewport | Emerging Cross-Sectional Technologies | 14 | Expired |
| US7229504B2 | Methods and apparatus for determining scrubber brush pressure | Performing Operations; Transporting | 13 | Expired |
| US6516816B1 | Spin-rinse-dryer | Emerging Cross-Sectional Technologies | 13 | Expired |
| US5567909A | Method for supporting a wafer in a combined wafer support and temperature monitoring device | Electricity | 12 | Expired |
| US7513062B2 | Single wafer dryer and drying methods | Electricity | 12 | Expired |
| US6904637B2 | Scrubber with sonic nozzle | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6551488B1 | Segmenting of processing system into wet and dry areas | Electricity | 11 | Expired |
| US6986185B2 | Methods and apparatus for determining scrubber brush pressure | Performing Operations; Transporting | 10 | Expired |
| US7980255B2 | Single wafer dryer and drying methods | Emerging Cross-Sectional Technologies | 10 | Active |
| US6406359B1 | Apparatus for transferring semiconductor substrates using an input module | Electricity | 9 | Expired |
| US6797074B2 | Wafer edge cleaning method and apparatus | Emerging Cross-Sectional Technologies | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.