Substrate strip and manufacturing method thereof
US6551855B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2001 |
| Grant date | Apr 22, 2003 |
| Priority date | — |
| Expiry date | Nov 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate strip includes a plurality of substrate units wherein each of the substrate units is accepted for packaging a semiconductor package. The substrate strip comprises: a frame having at least one opening; at least one first substrate unit integrally formed with the strip frame; and at least one second substrate unit disposed in the opening and securely attached to the strip frame by an adhesive. The present invention further provides a method for making the substrate strip. The method is conducted by separating defected substrate units from a substrate strip and securely attaching accepted substrate units back to the substrate strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.