Conductive collar surrounding semiconductor workpiece in plasma chamber
US6554954B2 · kind B2 · utility
36Cited by
33References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2001 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Apr 3, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma chamber apparatus and method having a process kit capable of reducing or eliminating electrical arcing from exposed metal at the perimeter of a workpiece. The plasma chamber includes a cathode electrode adjacent the workpiece. A process kit encircles the perimeter of the workpiece. The process kit includes a dielectric shield and an electrically conductive collar that overlies the dielectric shield. The resistivity of the conductive collar is 0.1 ohm-cm or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.