Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition
US6555762B2 · kind B2 · utility
17Cited by
22References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1999 |
| Grant date | Apr 29, 2003 |
| Priority date | — |
| Expiry date | Jul 1, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a unique, high density, electronic package having a conductive composition for filling vias or through holes to make reliable vertical or Z-connects from a dielectric layer to adjacent electrical circuits. The through holes may be plated or non-plated prior to filling. A description for making high density electronic packaging using this feature is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.