Patent · US Expired

Method and apparatus for updating a manufacturing model based upon fault data relating to processing of semiconductor wafers

US6556959B1 · kind B1 · utility

15Cited by
18References
32Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 12, 1999
Grant dateApr 29, 2003
Priority date
Expiry dateJul 12, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P90/02
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The present invention provides a method and apparatus for performing automated development and updating of a manufacturing model for a manufacturing process. An initial manufacturing model is developed. Tolerances of the manufacturing model are expanded using additional production data. The manufacturing model is then re-developed using the expanded tolerances.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.