Method for rinsing the backside of a semiconductor wafer
US6558474B1 · kind B1 · utility
0Cited by
17References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | May 6, 2003 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for rinsing the backside of a semiconductor wafer includes the operations of forming a wafer transport truck into a nozzle, and spraying a liquid from the nozzle onto the backside of the wafer. The nozzle may be disposed in a brush station, e.g., before an exit from a first brush box or before an exit from a second brush box.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.