Process for forming fusible links

US6559042B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Hans-Joachim Barth · Munich, DE
• Lloyd Burrell · Poughkeepsie, US
• Gerald Friese · Munich, DE
• Michael Stetter · Fishkill, US

Key dates

• Filing date: Jun 28, 2001
• Grant date: May 6, 2003
• Expiry date: Jun 28, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A process for forming fusible links in an integrated circuit includes forming the fusible link in the last metallization layer. The process can be employed in the fabrication of integrated circuits employing copper metallization and low k dielectric materials. The fusible link is formed in the last metallization layer and may be formed simultaneously with the bonding pad areas.