Patent · US Expired

Fluid distribution system and process, and semiconductor fabrication facility utilizing same

US6561213B2 · kind B2 · utility

62Cited by
3References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 5, 2001
Grant dateMay 13, 2003
Priority date
Expiry dateJun 5, 2021

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T137/86187
  • WIPO fieldMechanical elements
  • WIPO sectorMechanical engineering

Abstract

A fluid distribution system for supplying a gas to a process facility such as a semiconductor manufacturing plant. The system includes a main fluid supply vessel coupled by flow circuitry to a local sorbent-containing supply vessel from which fluid, e.g., low pressure compressed gas, is dispensed to a fluid-consuming unit, e.g., a semiconductor manufacturing tool. A fluid pressure regulator is disposed in the flow circuitry or the main liquid supply vessel and ensures that the gas flowed to the fluid-consuming unit is at desired pressure. The system and associated method are particularly suited to the supply and utilization of liquefied compressed gases such as trimethylsilane, arsine, phosphine, and dichlorosilane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.