Methods for making reinforced wafer polishing pads and apparatuses implementing the same
US6561889B1 · kind B1 · utility
39Cited by
20References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2000 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Dec 27, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad where the polishing pad is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt where the base belt includes a reinforcement layer and a cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.