Module assembly for stacked BGA packages
US6563217B2 · kind B2 · utility
59Cited by
67References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2002 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | May 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays. The ball grid array packages comprise flexible or rigid substrates. The ball grid array packages additionally comprise an arrangement for the substantial matching of impedance for the circuits connected to the semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.