Product using Zn-Al alloy solder
US6563225B2 · kind B2 · utility
78Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2002 |
| Grant date | May 13, 2003 |
| Priority date | — |
| Expiry date | Feb 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an electronic device comprising at least one electronic part and a substrate on which said electronic part is mounted, said electronic part and said substrate being bonded by a joint comprising a phase of Al particles and another phase of a Al—Mg—Ge—Zn alloy, said Al particles being connected to each other by said Al—Mg—Ge—Zn alloy phase.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.