Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
US6570102B2 · kind B2 · utility
11Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Jun 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and arrangement for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, there are provided vias of either through-holes, blind holes and buried holes filled with a conductive paste material to form electrical interconnections with conductive layers of the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.