Total release method for sample extraction from a charged-particle instrument
US6570170B2 · kind B2 · utility
45Cited by
8References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2002 |
| Grant date | May 27, 2003 |
| Priority date | — |
| Expiry date | Feb 28, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3056
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sample (180) is separated from an integrated circuit chip or a semiconductor wafer (100) for examination so that the resulting sample (180) can be moved to a location for examination by TEM, SEM or other means. A sample (180) portion of the chip or wafer (100) containing an area of interest is separated with a two cuts (140, 160) at two different angles (130, 170) by a focused ion-beam (120). Only after the sample (180) is separated is it fixed to a micromanipulator probe (190). The sample (180) is then moved by the probe (190) to the location for examination.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.