Flip chip image sensor package fabrication method
US6571466B1 · kind B1 · utility
224Cited by
32References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2000 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.