Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the same
US6572463B1 · kind B1 · utility
38Cited by
18References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2000 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | May 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0009
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A seamless polishing apparatus for utilization in chemical mechanical polishing is disclosed. The seamless polishing apparatus includes a base belt that has a reinforcement layer and a cushioning layer. The seamless polishing apparatus also includes a polishing pad that is attached to the base belt as a result of a direct casting of a polymeric precursor on a top surface of the cushioning layer. In addition, the cushioning layer is an intermediary layer between the polishing belt pad and the base belt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.