Semiconductor wafer support lift-pin assembly

US6572708B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Rudolf Gujer · Saratoga, US
• Thomas Cho · Palo Alto, US
• Lily Pang · Fremont, US
• Michael P. Karazim · San Jose, US
• Tetsuya Ishikawa · Fuji, JP

Key dates

• Filing date: Feb 28, 2001
• Grant date: Jun 3, 2003
• Expiry date: Jul 25, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C23C16/4586
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A modular lift-pin assembly comprises a lift-pin having a distal end and a connector having a lift-pin end and an actuator end. The lift-pin end of the connector is coupled to the distal end of the lift-pin and an actuator pin is then coupled to the actuator end of the connector to actuate the lift-pin through the connector.