Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame
US6573121B2 · kind B2 · utility
88Cited by
17References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2001 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Apr 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.