Graded metallic leads for connection to microelectronic elements
US6573459B2 · kind B2 · utility
8Cited by
16References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2002 |
| Grant date | Jun 3, 2003 |
| Priority date | — |
| Expiry date | Jul 22, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24983
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.